Leave the evaluation of contact surface/interface thermal resistance of semiconductor devices to us.
Precision multi-scale thermal resistance evaluation technology to solve contact surface/interface thermal issues in semiconductor device packaging.
With the advancement of semiconductor devices, the thermal resistance of contact surfaces and interfaces has become an important issue. In AI chips, GPUs, NPUs, and power semiconductors, the amount of heat generated has been increasing year by year, and even small thermal resistances can lead to serious temperature rises. Furthermore, in advanced packaging technologies such as flip-chip mounting and heterogeneous integration, controlling the thermal resistance at the bonding interface is essential. There is also a demand for the development of higher-performance materials and precise thermal property evaluations for solder joints in conventional technologies, as well as TIM1 inside the package and TIM2 outside. Bethel's product line enables diverse thermal resistance evaluations on scales from micrometers to several tens of millimeters through thermal microscopes (TM), thermo-wave analyzers (TA), and steady-state thermal conductivity measurement devices (SS-H40).
- Company：ベテル 本社・工場、東京オフィス、ハドソン研究所、ベトナム工場
- Price：500,000 yen-1 million yen
